Diffusion bonding
US3964667A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 19, 1966 |
| Grant date | Jun 22, 1976 |
| Priority date | — |
| Expiry date | Jan 19, 1986 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
1. A method for joining beryllium to beryllium by diffusion bonding, comprising the steps of coating at least one surface portion of at least two beryllium pieces with nickel, positioning a coated surface portion in a contiguous relationship with an other surface portion, subjecting the contiguously disposed surface portions to an environment having an atmosphere at a pressure lower than ambient pressure, applying a force upon the beryllium pieces for causing the contiguous surface portions to abut against each other, heating the contiguous surface portions to a maximum temperature less than the melting temperature of the beryllium, substantially uniformly decreasing the applied force while increasing the temperature after attaining a temperature substantially above room temperature, and maintaining a portion of the applied force at a temperature corresponding to about maximum temperature for a duration sufficient to effect the diffusion bond between the contiguous surface portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.