Solder glass composition and method of using same for encapsulating devices
US3964920A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1973 |
| Grant date | Jun 22, 1976 |
| Priority date | — |
| Expiry date | Oct 26, 1993 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for sealing two ceramic pieces, a lead frame and a semiconductor chip together involving the application of pressure to a layer of sealing glass composition which remains vitreous throughout the sealing process is disclosed. The sealing glass composition comprises a mixture of sealing glass and zirconium silicate in the volume percentage amounts of 50-62 percent of glass and 50-38 percent of zirconium silicate. The glass components comprise, as a percentage weight of the glass alone, SiO.sub.2 about 0-2 percent, PbO about 65-72 percent, ZnO about 5-10 percent, PbF.sub.2 about 2-10 percent, CdO about 1-5 percent, TiO.sub.2 about 0.5-3 percent and B.sub.2 O.sub.3 about 10-14 percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.