Apparatus for processing semiconductor wafers
US3964957A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 1974 |
| Grant date | Jun 22, 1976 |
| Priority date | — |
| Expiry date | Sep 30, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Circular wafers of semiconductor (silicon) are chemically treated, e.g., etched, by supporting the wafers vertically by contacting their edges with annularly grooved drive rollers, immersing the supported wafers in a body of chemical medium (e.g., etchant solution) for treatment, and rotating the wafers by rotation of the drive rollers while the wafers are immersed in the body of medium to uniformly and precisely treat the surfaces of the wafers. Apparatus for effecting such precision etching includes an etchant tank, a wafer rack including the drive rollers which support the edges of the wafers in vertical face-to-face relationship, the rack being lowered into the etchant to immerse the wafers. Means is disclosed for rotating the drive rollers for rotation of the immersed wafers and provision is included for circulating the etchant for causing uniform flow thereof past the rotating wafers. A heat exchanger maintains the etchant substantially at a predetermined temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.