Use of organopolysiloxane compositions which cure at ambient temperature in coating electrical and electronic devices
US3965280A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 1975 |
| Grant date | Jun 22, 1976 |
| Priority date | — |
| Expiry date | May 5, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Electrical and electronic devices are coated with an organopolysiloxane composition which consists essentially of a mixture of the following ingredients by weight: I 100 parts of a .alpha.,.omega.-dihydroxydiorganopolysiloxane polymer, of viscosity at least about 600 cPo at 25.degree.C, ii 1 to 15 parts of an organosilicon compound which is either A a monomer of the formula (A): R.sub.x Si[(OCH.sub.2 CH.sub.2).sub.a OR'].sub.4.sub.-x', or B a polymer resulting from the partial hydrolysis of at least one monomer of formula Si(OR').sub.4 ; iii 0.2 to 6 parts of an organic derivative of titanium, which is either: A a monomer of the formula (B): Ti[OCH.sub.2 CH.sub.2).sub.b OR"].sub.4', b a polymer resulting from the partial hydrolysis of at least one monomer of the formula Ti(OR").sub.4 ; c a titanium chelate of the formula (C): ##EQU1## OR D A TITANIUM CHELATE OF THE FORMULA (D): ##EQU2## iv 0 to 100 parts of an optionally organosilicontreated inorganic filler; V 0 TO 100 PARTS OF PLASTICISER AND/OR ORGANOSILICON STABILISER; AND Vi 0.5 to 8 parts of an organosilicon resin consisting of units of the formulae R"'(CH.sub.3).sub.2 SiO.sub.0.5 and SiO.sub.2. The coating is then cured on t…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.