Process of preparing a secondary electron emissive coating on the interior walls of a microchannel plate

US3967001A · kind A · utility

Assignee

• The United States of America as represented by the Secretary of the Army · US

Inventors

• Bipin C. Almaula · Washington, US
• Philip G. Reif · Calabasas, US

Key dates

• Filing date: Sep 20, 1974
• Grant date: Jun 29, 1976
• Expiry date: Sep 20, 1994

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C16/045
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A process of preparing a nickel secondary electron emissive conductive cong along the interior channel walls of a microchannel plate or by continuing the process of preparing a solid nickel conductor channel to provide a conductive panel and the apparatuses resulting therefrom. The microchannel plate is positioned in a heated oven, or deposition chamber, such that heated inert gases are forced through the open channels to stabilize the channel temperature. The temperature is then lowered and a nickel compound gas is mixed with the inert gas. The gas mixture is forced through the channels to decompose the microchannel plate material and deposit a thin nickel coating on the interior channel walls. If a conductive panel is desired, the process is continued until the entire channel is completely filled with nickel.