Method of manufacturing a low energy-loss waveguide circuit element
US3967484A · kind A · utility
1Cited by
7References
6Claims
0Family size
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Inventors
Key dates
| Filing date | Dec 26, 1974 |
| Grant date | Jul 6, 1976 |
| Priority date | — |
| Expiry date | Dec 26, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing low energy-loss waveguide circuit elements in which a film of metal with a low resistivity is joined to a base metal by thermal pressing or electric plating, and a hard male die of a desired shape is pressed into the base metal from above the metal film, whereby a plastic strain is caused in the base metal thereby to form a recessed portion in the base metal having an internal surface covered with the low resistivity metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.