Process for the manufacture of chip boards using condensation resins as binders and product
US3968308A · kind A · utility
6Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1974 |
| Grant date | Jul 6, 1976 |
| Priority date | — |
| Expiry date | Dec 16, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31946
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a process for the manufacture of chip boards especially multi-layer chip boards, using condensation resins as binders, and the products thereof the improvement including wetting powdered adhesive particles before applying the adhesive particles to wood chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.