Laminating method
US3969177A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 1974 |
| Grant date | Jul 13, 1976 |
| Priority date | — |
| Expiry date | Jun 24, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/3423
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Method of laminating pluralities of sheets as unitary panels with heat and pressure curable adhesive in which unlaminated, uncured sheet pluralities are alternately stacked in a press lay-up with partially cured or semicured unitary sheet pluralities and the entire layup is subjected to heat and pressure for a time sufficient to partially cure the originally uncured sheet pluralities and bring the interspersed, partially cured sheet pluralities to full cure. Thereafter, the newly partially cured and fully cured units are removed and the partially cured units used alternately with new uncured sheet pluralities. This method obviates the need for planishing plates heretofore used to produce smooth surfaces on metal foil covered core units for printed circuit manufacture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.