Backside laser dicing system
US3970819A · kind A · utility
85Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1974 |
| Grant date | Jul 20, 1976 |
| Priority date | — |
| Expiry date | Nov 25, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer of semiconductor material having a plurality of units defined on its face is subdivided by treating the wafer, on its back or reverse side, in the kerf regions between the units, where division of the units is desired, such that the material of the wafer in the treated kerf regions is converted to a material having a breaking strength lower than the breaking strength of the semiconductor material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.