Low profile integrated circuit connector and method
US3975072A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 15, 1974 |
| Grant date | Aug 17, 1976 |
| Priority date | — |
| Expiry date | Apr 15, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/943
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A low profile connector for electrical components having a plurality of leads extending therefrom, such as integrated circuit packages. Rectangular folded contacts, each having an open top lead receiving socket portion, are press fitted into aligned apertures in a substrate with the socket portions lying above the substrate surface. An insulative housing having recesses therein open at each end is laid over the ends of the contacts to receive each one of the socket portions up into a recess in the housing. A component is receiving onto the top surface of the housing with the leads therefrom extending down through the top openings of the recesses into the lead receiving socket portions of the contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.