Metal plating solution
US3977884A · kind A · utility
15Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 1975 |
| Grant date | Aug 31, 1976 |
| Priority date | — |
| Expiry date | Jan 2, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless metal plating solution is characterized by an elemental sulfur stabilizer, either in colloidal or soluble, non-ionic form. Elemental sulfur as a stabilizer is an improvement over prior art stabilizers as it can be used in substantially larger concentration than prior art divalent sulfur stabilizers which are catalytic poisons.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.