Method for packaging semiconductor devices
US3978578A · kind A · utility
41Cited by
8References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 29, 1974 |
| Grant date | Sep 7, 1976 |
| Priority date | — |
| Expiry date | Aug 29, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved method of packaging semiconductor devices and dice which comprises coating a semiconductor wafer with a polyimide film, etching selected areas of the polyimide film from the surface of the wafer, separating the wafer into a plurality of semiconductor dice wherein each of the dice have electrical contacts to circuits within the device and making ohmic electrical connection with the electrical contacts on the dice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.