Process for chemical-mechanical polishing of III-V semiconductor materials
US3979239A · kind A · utility
60Cited by
6References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 30, 1974 |
| Grant date | Sep 7, 1976 |
| Priority date | — |
| Expiry date | Dec 30, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/959
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method for combined chemical-mechanical polishing of III - V semiconductor planar surfaces by applying a weak aqueous hydrochloric acid solution in combination with an aqueous source of chlorine to the surface to be polished while simultaneously mechanically polishing the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.