Method for the manufacture of tubular bodies of semiconductor material
US3979490A · kind A · utility
5Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1973 |
| Grant date | Sep 7, 1976 |
| Priority date | — |
| Expiry date | Nov 19, 1993 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B23/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
For the manufacture of tubular bodies of semiconductor material, particularly of silicon, by the precipitation of a layer in the form of a hollow cylinder on a rod or tube-shaped, electrically heated carrier in a reaction gas suitable for the deposition of the semiconductor in question, with subsequent separation of the semiconductor layer from the carrier, the carrier is differentially heated in such a manner that the generated hollow-cylinder layer is given an annular, bead-like reinforcement; the separation of the tube obtained into parts is achieved by a cut made within the reinforcement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.