Method of forming panels
US3982985A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 1975 |
| Grant date | Sep 28, 1976 |
| Priority date | — |
| Expiry date | May 5, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of forming a panel having a surface pattern, comprising placing a superstate lamina shaped to define the desired pattern onto a substrate, the substrate and superstrate both comprising cellular thermoplastic materials which are mutually discernible, pressing a die face against the surface of the superstrate lamina and against at least that portion of the substrate adjacent the superstrate, said die face having a temperature above the softening temperature of both the superstate and substrate thermoplastic materials, to thereby collapse the cellular structure of the superstrate and the substrate where contacted by the die and form an integral non-cellular surface layer containing the pattern as an integral part thereof, cooling the die face to harden said layer, and removing the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.