Method of coating a substrate with curable organopolysiloxane compositions
US3983265A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 14, 1975 |
| Grant date | Sep 28, 1976 |
| Priority date | — |
| Expiry date | May 14, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Substrates, particularly electronic connections, are protected by coating the substrate with a curable organosilicon composition based on .alpha.-.omega.-dihydroxy diorganopolysiloxanes, methyl polysiloxanes, fillers, amino organosilicon cross linking agents and optionally alkyl silicates or polysilicates, which are vulcanizable at ambient temperature or above, are improved by using a methylpolysiloxane in which the ratio of the R(CH.sub.3).sub.2 SiO.sub.0.5 units (R=C.sub.1 --C.sub.3 alkyl or vinyl) to SiO.sub.2 units is 0.4:1 to 1.2:1 and which contains 0.5 - 3.5% by weight OH groups bonded to Si and by using an amino organosilicon compound which is an aminoorganosilane of the general formula (i) (R"O).sub.3.sub.-p R'.sub.p Si[(CH.sub.2).sub.n O].sub.m (CH.sub.2).sub.t NHQ in which R' represents an alkyl group with 1 to 4 carbon atoms, a vinyl group or a phenyl group, R" represents a methyl, ethyl or methoxyethyl radical, Q represents a hydrogen atom or the radical --(CH.sub.2).sub.2 NH.sub.2, p and m represent 0 or 1, n represents 1,2,3 or 4, and t represents 2 or 3, or an aminoorganopolysiloxane produced by reacting the aminoorganosilane (i) above, in which p is 0, with a hydro…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.