Thermoelectric heating and cooling apparatus
US3986337A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 30, 1975 |
| Grant date | Oct 19, 1976 |
| Priority date | — |
| Expiry date | Jun 30, 1995 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF24F5/0042
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
This invention pertains to an improved thermal slab assembly. A metal slab defines an exterior surface of the assembly and is supported on a hollow chassis. A plurality of thermoelectric devices are conductively engaged with the underside of the slab and are disposed in a regular array relative to each other, whereby each device is assigned a respective one of a corresponding plurality of equal area portions of the slab. Control means are coupled between the slab and the thermoelectric devices for sensing the temperature of the slab and for regulating operation of the devices to establish and maintain a predetermined temperature of the slab. A vertically and parallelly finned heat sink is conductively coupled to each thermoelectric device. Baffle means are located in the housing and are engaged between the chassis floor and the slab, and also with the heat sinks at the outer surfaces of the outer fins thereof and at the lower ends of the fins thereof, for dividing the housing interior into an inner chamber and an outer chamber. The baffle means cooperate with the heat sinks for defining ports between the inner and outer chambers only via the spaces between the fins of the heat sink…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.