Solder removal device
US3987954A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 10, 1975 |
| Grant date | Oct 26, 1976 |
| Priority date | — |
| Expiry date | Oct 10, 1995 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/012
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder removal device has air under pressure supplied thereto. The device has a hollow handle in which is disposed a Venturi structure for creating a vacuum where the vacuum is applied through a solder collection chamber also disposed in the handle and a solder extraction tube in communication with the solder collection chamber and extending outside of the handle. The air discharged from the Venturi structure is directed around the solder collection chamber and out an opening in the handle whereby heat is removed from the solder collection chamber, the heat having been generated by hot air and solder sucked into the chamber. Hence, the device may be used continuously for solder extraction without discomfort to the operator's hand. A rotatable cover is also provided in the handle for either partially or completely blocking the air discharged from the Venturi structure whereby air is blown outwardly through the suction tube so that a hot air jet suitable for melting solder is effected when the discharge air is partially blocked and a high intensity jet is effected suitable for blowing away loose solder or the like when the discharge air is completely blocked. A trigger is optionall…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.