Method of fabrication of electroemissive components
US3988222A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jan 21, 1975 |
| Grant date | Oct 26, 1976 |
| Priority date | — |
| Expiry date | Jan 21, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J9/022
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electroemissive component having variable emissivity is made up of a conductive substrate on which at least one continuous thin film of a solid organometallic compound has been formed by electrochemical deposition and of a conductive deposit constituted by at least one thin film and deposited on said organometallic film, the substrate and the conductive deposit being electrically connected respectively to the two poles of a variable-voltage source which controls the emissivity. The component is particularly well suited to the fabrication of electronic or optoelectronic devices such as electron tubes, luminescent cells, display panels, thin television screens, and brightness amplifiers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.