Polyamide compositions
US3988287A · kind A · utility
11Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1975 |
| Grant date | Oct 26, 1976 |
| Priority date | — |
| Expiry date | Jan 24, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/5425
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide composition comprising a polyamide, an inorganic filler, a compound containing an unsaturated double bond and an epoxy group in one molecule and an unsaturated organic silane. Preferably, said compound having an unsaturated double bond and an epoxy group in one molecule and said unsaturated organic silane are present in the heat-polymerized state in the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.