Method of holding articles
US3989566A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1972 |
| Grant date | Nov 2, 1976 |
| Priority date | — |
| Expiry date | Nov 20, 1992 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An array of discrete semiconductor devices is formed by photoresist and etching techniques in a semiconductor wafer waxed to a support. The photoresist material is then removed and the devices are tested. Next, a substrate is coated with silicone resin to which the devices will adhere. The devices found from the test to have a first characteristic are transferred to the resin-coated substrate to form a new array of first characteristic semiconductor devices with the original orientation. The devices are pressed against the resin by means of a polytetrafluoroethylene screen overlaid with a stainless steel screen and trichlorethylene is flowed through the screens to the devices to remove any remanent wax. When the screens are removed the devices do not stick to the polytetrafluorethylene screen, which had been against them, but remain held on the resin coated substrate in their originally oriented array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.