Photosensitive epoxy-acrylate resin compositions
US3989610A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1974 |
| Grant date | Nov 2, 1976 |
| Priority date | — |
| Expiry date | Feb 12, 1994 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/032
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photosensitive resin composition consisting of, or comprising as the essential components, (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (C) a compound containing at least two epoxy groups, and (D) a compound selected from the group consisting of dicyandiamide, p,p'-diaminodiphenyl compounds, polycarboxylic acids having at least two carboxyl groups, polycarboxylic anhydrides and mixtures of the polycarboxylic acids and the polycarboxlic anhydrides. The above photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence, can be used in the production of printed circuit boards, precision-processing of metals and as materials for adhesives, paints, plastic relief and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.