Method for the production of material for printed circuits
US3990926A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 22, 1975 |
| Grant date | Nov 9, 1976 |
| Priority date | — |
| Expiry date | May 22, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/92
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for the production of a material for printed circuits is disclosed. A temporary base is coated by electroplating with a thin, unbroken and unpatterned metallic layer having a thickness less than 17.mu.m and the free surface of said metallic layer is bonded to a final insulating base. The temporary base is thereafter removed and the desired wiring pattern is produced by a process comprising etching of the metal layer. A material for use in production of printed circuits is also disclosed comprising a temporary base which is coated by electroplating with a thin, unbroken and unpatterned metal layer having a thickness less than 17.mu.m. Said material can comprise a final, insulating base bonded to the free surface of the thin metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.