Sulfite gold plating bath and process
US3990954A · kind A · utility
4Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1973 |
| Grant date | Nov 9, 1976 |
| Priority date | — |
| Expiry date | Dec 17, 1993 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/48
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is an improved electroplating bath and process for obtaining semi-bright to bright electrodeposits of gold and gold alloys. The electroplating bath contains a gold sulfite complex and a nitrogen-free diphosphonic compound having at least two phosphonic groups attached directly to a carbon atom. Presence of the nitrogen-free phosphonate compound enhances the stability of the gold sulfite baths and improves the brightness of electrodeposits obtained therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.