Adhesive bonding method allowing nondestructive separation of bonded materials
US3993524A · kind A · utility
2Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1975 |
| Grant date | Nov 23, 1976 |
| Priority date | — |
| Expiry date | Jul 1, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49821
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Incombustible materials are bonded together with a self-burning adhesive composition which is a mixture of an organic polymer base structural adhesive as typified by an epoxy adhesive and an oxidizer as exemplified by an ammonium perchlorate powder, so that the bonded materials can be disassembled nondestructively, if desired, by heating the joint to the ignition point of the composition and leaving the composition in the joint to burn self-supportedly until it vanishes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.