Catalytic developer
US3993801A · kind A · utility
16Cited by
8References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 18, 1975 |
| Grant date | Nov 23, 1976 |
| Priority date | — |
| Expiry date | Feb 18, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/28
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Improved processes and systems are described for the reception of electroless plating of non-metallic substrates, the processes comprising forming a coating of metal ions onto the non-metallic substrate, immersing the coated substrate in a developer solution containing ions selected from nickel, cobalt and copper ions and mixtures thereof and a reducing agent, and thereafter immersing the substrate in conventional electroless plating baths, e.g., nickel or cobalt-hypophosphite baths or a copper-formaldehyde bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.