Activation of substrates for electroless metallization with zero valent palladium complex

US3993807A · kind A · utility

Assignee

• BASF SE

Inventors

• Joachim Stabenow · Weinheim, DE
• Gerd Wunsch · Speyer, DE
• Paul Deigner · Bad Dürkheim, DE
• Franz Mueller · Fort Wayne, US
• Werner Loeser · Ludwigshafen, DE
• Werner Steck · Ludwigshafen, DE

Key dates

• Filing date: Oct 24, 1975
• Grant date: Nov 23, 1976
• Expiry date: Oct 24, 1995

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C07F15/006
• WIPO field: Organic fine chemistry
• WIPO sector: Chemistry

Abstract

A process for metallizing substrates by activation of the substrate by deposition of palladium from a palladium complex, followed by electroless metallization. The palladium is deposited on the substrate by dipping the substrate into a solution of a palladium(O) complex and decomposing this complex at from 100.degree. to 300.degree. C. With this method it is possible to effectively activate substrates which are attacked by acid or alkali or swollen by organic solvents.