Thin films containing metallic copper and silver by replacement without subsequent accelerated oxidation
US3993845A · kind A · utility
19Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1975 |
| Grant date | Nov 23, 1976 |
| Priority date | — |
| Expiry date | Apr 17, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Novel copper-silver metallic films are prepared on transparent articles by chemical replacement of silver for copper according to the method of the present invention. A transparent article is coated with a metallic copper film by a conventional method of deposition. The copper coated article is then contacted by a solution comprising a silver salt, ammonia and a complexing agent which promotes replacement but which does not accelerate the oxidation of residual metallic copper in the film. Replacement of copper by silver occurs with the film retaining its reflective metallic character.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.