Patent · US Expired

Electrolytic plating apparatus for discrete microsized particles

US3994796A · kind A · utility

6Cited by

6References

4Claims

0Family size

Assignee

The United States of America as represented by the United States Energy Research and Development Administration · US

Inventor

Anton Mayer · Niedernhausen, DE

Key dates

Filing date	Sep 11, 1975
Grant date	Nov 30, 1976
Priority date	—
Expiry date	Sep 11, 1995

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E30/10
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Method and apparatus are disclosed for electrolytically producing very uniform coatings of a desired material on discrete microsized particles. Agglomeration or bridging of the particles during the deposition process is prevented by imparting a sufficiently random motion to the particles that they are not in contact with a powered cathode for a time sufficient for such to occur.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.