Curable organosilicon compositions
US3996195A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 1974 |
| Grant date | Dec 7, 1976 |
| Priority date | — |
| Expiry date | Nov 15, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An improved curable organosilicon composition is formulated by blending a resin-type organopolysiloxane containing vinyl groups equivalent to 2.0 to 40 mole % of the organic groups with an organohydrogenpolysiloxane containing at least 2 hydrogen atoms directly bonded to the silicon atoms and epoxy and/or ester groups bonded to the silicon atoms through carbon atoms in the presence of a platinum catalyst, in which hydrosilation reaction takes place between the vinyl groups and the silicon-bonded hydrogen atoms to give crosslinked structure to volume cured. The compositions have a sufficiently long pot life and on curing create strong adhesion to metal, glass and ceramic and the like surfaces. The cured compositions have very high transparency and good thermal stability, and they are useful for various applications such as the manufacture of electronic parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.