Magnetic bubble, field-access assembly
US3996574A · kind A · utility
7Cited by
3References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 24, 1975 |
| Grant date | Dec 7, 1976 |
| Priority date | — |
| Expiry date | Feb 24, 1995 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C19/085
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A dual-in-line package (DIP) for a bubble memory is achieved by mounting the bubble chip in a cantilevered position in the plane of a rigid conductor arrangement which is interconnected to a DIP base. The lead track arrangement forms a rigid support for the chip fixing the chip in a position for receiving the orthogonal coils which characteristically supply the rotating field for field-access bubble operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.