Molding compounds
US3998909A · kind A · utility
13Cited by
5References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1974 |
| Grant date | Dec 21, 1976 |
| Priority date | — |
| Expiry date | Sep 3, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/921
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The surface characteristics, including shrink and gloss of molded thermosetting resin compounds, are improved by incorporating into the thermosetting resin a thermoplastic composition produced by the polymerization of a monomer with unsaturated elastomeric polymers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.