Process of bonding polysulfide sealant and caulk compositions
US4000347A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1975 |
| Grant date | Dec 28, 1976 |
| Priority date | — |
| Expiry date | Mar 27, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31533
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
This invention relates to enhancing the bonding of polysulfide sealants to a variety of inorganic substrates, most particularly, to metal, ceramic, concrete, and glass substrates. The enhanced bonding of the polysulfide sealant is achieved by the use of a silane adhesion promoter which is characterized by the following formula: (S.sub.n).sub.a [R -- SiX.sub.3 ].sub.b wherein n is a number ranging from about 2 to about 6, a is a number equal to one-half the free valence of R, b is a number equal to at least 2, R is a divalent organic radical joined at one end to sulphur and at the other end to silicon, and X is a hydrolyzable group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.