Chemical plating process
US4002778A · kind A · utility
56Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1975 |
| Grant date | Jan 11, 1977 |
| Priority date | — |
| Expiry date | Dec 15, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/072
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for chemical plating of nickel or cobalt onto materials otherwise noncatalytic to the plating baths by pretreating the materials with a reducing agent such as sodium borohydride or dimethylamine borane prior to chemical plating. Treating the material with an oxidizing agent prior to the pretreatment is also useful, especially for plating copper. The invention is particularly desirable for plating nickel onto copper conductor patterns on polymeric substrate circuit boards. The copper is plated with nickel, and the substrate is not.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.