Method for preparing thin film integrated circuit
US4003772A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1975 |
| Grant date | Jan 18, 1977 |
| Priority date | — |
| Expiry date | Feb 18, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02258
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thin film integrated circuit consists of a first conductor of aluminum extended in any desired direction on an insulating substrate, an anodized film formed by anodization in a chromic acid solution at positions other than cross-connectional parts on the first conductor, a second conductor cross-connected on the first conductor, and an anodized film formed by anodization in a chromic acid solution on the surface of the second conductor. The thin film integrated circuit is prepared by partially forming an anodized film in a sulfuric acid or oxalic acid solution at cross-connectional parts of a first conductor of aluminum so as not to form any anodized film in a chromic acid solution at the cross-sectional parts of the first conductor of the circuit, masking the partially formed anodized film with a photoresist film, then forming an anodized film by a chromic acid solution, and then removing the photoresist film and the anodized film. After the cross-sectional parts of the first conductor are exposed thereby, a second conductor is formed. For an etching solution for anodized film, which is anodized using the sulfuric acid or oxalic acid solution, a mixed solution consisting of 60 t…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.