Method of electroplating of aluminum and plating baths therefor
US4003804A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 31, 1975 |
| Grant date | Jan 18, 1977 |
| Priority date | — |
| Expiry date | Dec 31, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Two improved methods are described for the electrodeposition of aluminum or an alloy thereof onto an electrically conducting, preferably metallic, substrate which methods comprise: PA1 A. reacting aluminum with hydrogen halide (preferably hydrogen bromide) in the absence of water, and in an aromatic hydrocarbon solvent (toluene) to form a plating hydro aluminum halide cation in solution, the concentration of the plating aluminum cation and the concentration of hydrogen ion, in solution being, respectively, below 7.5M and 1.1M and preferably below 4.2M and 0.5M. Various bromine getters are bubbled or passed through the region of the anode, to react with bromine produced, and to prevent attack of the plated aluminum by the bromine produced, or, alternatively. PA1 B. reacting aluminum with hydrogen halide (preferably hydrogen bromide) in an aromatic hydrocarbon solvent to form an anhydrous plating, hydro aluminum bromide cation, in solution, of the type set forth in (a) above, and then adding an alkyl halide to form a different plating species, the amount of alkyl halide added being preferably a small percentage of the amount of aromatic solvent employed. Also, the method of directing…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.