Heat-sink assembly for high-power stud-mounted semiconductor device
US4004195A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 1975 |
| Grant date | Jan 18, 1977 |
| Priority date | — |
| Expiry date | May 12, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-sink assembly adapted for use with a high-power stud-mounted semiconductor device comprises a heat-dispersing arm having one end securely attached to a circuit board and the other end shaped for semipermanent connection and thermal coupling to a heat-conductive stud. The arm is sufficiently bendable to allow displacement thereof from above the surface of the device mounted on the circuit board for removal of the device from the circuit board after disconnecting the other end from the stud while keeping the one end securely attached to the circuit board. The heat-sink assembly may further comprise means for semipermanently connecting the other end of the arm to the stud and retaining the other end in intimate thermal contact therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.