Interlayer for transient liquid phase diffusion bonding
US4005988A · kind A · utility
19Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1975 |
| Grant date | Feb 1, 1977 |
| Priority date | — |
| Expiry date | Dec 19, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/941
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A reduced melting point interlayer for transient liquid phase diffusion bonding of the nickel, cobalt and iron alloys is provided as a thin coating integral with one or more of the surfaces to be joined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.