Photodeposition of metals on a non-conductive substrate
US4006269A · kind A · utility
4Cited by
4References
92Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 29, 1974 |
| Grant date | Feb 1, 1977 |
| Priority date | — |
| Expiry date | Nov 29, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/185
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for sensitizing a substrate of non-conductive material for the deposition thereon of a conductive film of copper or nickel comprises the steps of applying to the substrate a substance which can photochemically abstract a hydrogen atom from a hydrogen donor in the presence of a suitable solvent, and subsequently immersing the sensitized substrate in a solution containing certain metal ions such as copper, nickel or silver, and simultaneously exposing the sensitized substrate to radiation from an ultraviolet light source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.