Semiconductor component with pressure contact
US4008487A · kind A · utility
7Cited by
1References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 15, 1975 |
| Grant date | Feb 15, 1977 |
| Priority date | — |
| Expiry date | Jul 15, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a semiconductor device incorporating a semiconductor element which is provided with a housing having at least a base member, a top member and an insulator member which connects the base and top members, the housing having enclosed within it a semiconducting element which is clamped in place between two electrodes by means of at least one spring, the semiconducting element being electrically connected to the electrodes by a thin layer of soft solder, the semiconductor device being provided with a current supply lead which is in contact with at least one of the exterior faces of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.