Electrodeposition of copper
US4009087A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 24, 1975 |
| Grant date | Feb 22, 1977 |
| Priority date | — |
| Expiry date | Dec 24, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to a process and to novel compositions for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member from each of the following two groups: PA1 A. an N-heteroaromatic compound containing 1 or 2 N-heteroaromatic rings, said rings being selected from a group comprising pyridine, quinoline, isoquinoline and the benzoquinolines, which compound does not contain non-quaternary amino groups that are not part of the said N-heteroaromatic rings, nor bivalent sulfur atoms, and is not quaternized on its ring nitrogen atoms by aralkyl, aryl, alkaryl radicals; and PA1 B. sulfoalkylsulfide and sulfoarylsulfide compounds containing the grouping --S.sub.n --X--SO.sub.3 M where n = 1 to 5, --X-- is a divalent aliphatic hydrocarbon group of 1 to 8 carbon atoms or a divalent aromatic or aliphatic-aromatic hydrocarbon group of 6 to 12 carbon atoms and M is one gram-equivalent of a cation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.