Aperture sealing device for film lead fabrication
US4009683A · kind A · utility
0Cited by
7References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 1975 |
| Grant date | Mar 1, 1977 |
| Priority date | — |
| Expiry date | Dec 12, 1995 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A positive pressure apparatus for depositing a thin, even layer of an adhering liquid material to seal openings on a metallic clad film-type carrier is disclosed. The openings, on the film side opposite the metallic lamination, are covered prior to the etching process in order to minimize undercutting by the etching material on the metallic lamination and to provide support for the resulting integrated circuit leads. The apparatus uses a positive pressure mechanism to force the fluid material through a porous ceramic element in order to obtain uniform flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.