Electronic apparatus with optional coupling
US4010488A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1975 |
| Grant date | Mar 1, 1977 |
| Priority date | — |
| Expiry date | Nov 21, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In the manufacture of certain types of electronic devices, a plurality of leads are simultaneously bonded in side-by-side relation to a corresponding number of "active" bonding sites or pads on a substrate, the "active" pads being the ends of conductive paths on the substrate. Particularly narrow active bonding pads are used to minimize the possibility of shorting together adjacent pads by leads which are not properly aligned on centers with the pads. Electrically isolated "dummy" pads, comprising relatively small metallized areas are not connected to conductive paths, are provided on the substrate between each active pad. Portions of the misaligned leads extending beyond the edges of the active pads overlap and are bonded to the dummy pads, thus minimizing the loss of bonding strength otherwise caused by the misalignment of the leads with the active pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.