Method of controlling the softening point of solder glass
US4011060A · kind A · utility
4Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1975 |
| Grant date | Mar 8, 1977 |
| Priority date | — |
| Expiry date | Oct 2, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C8/245
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A process for controlling the softening point and for providing a preselected softening point of solder glass which comprises bubbling oxygen-containing gas through a homogeneous melt of a solder glass containing copper oxide at a temperature and oxygen partial pressure predetermined to provide the desired preselected softening point of the solder glass and for a time sufficient to achieve equilibrium of the reaction Cu.sub.2 O+1/2O.sub.2 .revreaction.2CuO.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.