Encapsulated microcircuit package and method for assembly thereof
US4012579A · kind A · utility
36Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 1975 |
| Grant date | Mar 15, 1977 |
| Priority date | — |
| Expiry date | Feb 21, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/103
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microcircuit deposited on a substrate is encapsulated within a housing having bottom and top cover portions. The substrate initially is adhesively secured to the bottom cover portion. The bottom and top cover portions then are placed into engagement, the assembled housing containing the substrate is cured, and a potting compound is injected into, and allowed to solidify between, the cover portions to encapsulate the microcircuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.