Diced substrate S.A.W. device for bulk wave attenuation
US4012650A · kind A · utility
10Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 1974 |
| Grant date | Mar 15, 1977 |
| Priority date | — |
| Expiry date | Aug 29, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/02866
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
In acoustic surface wave devices the bottom of the substrate is provided with a plurality of discrete recesses to attenuate and/or scatter bulk waves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.