Heat sink with parallel flat faces
US4012769A · kind A · utility
29Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1975 |
| Grant date | Mar 15, 1977 |
| Priority date | — |
| Expiry date | Aug 4, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a unitary heat sink apparatus for dissipating thermal energy generated by semiconductor devices encapsulated in an encapsulation device of the JEDEC TO-202 or Motorola Case 152 device case style. The heat sink is a unitary sheet metal device folded to form two opposed end plates joined by a central barrel portion which acts as a spring to urge the opposed faces of the end plates together. The thermal conductor tab extending from the encapsulation device is held between the opposed faces of the end plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.