Tin-gold electroplating bath and process
US4013523A · kind A · utility
11Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 24, 1975 |
| Grant date | Mar 22, 1977 |
| Priority date | — |
| Expiry date | Dec 24, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/62
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is an aqueous electroplating bath suitable for plating a tin-gold alloy and a process of plating employing that bath. The bath contains gold as the auricyanide complex and tin as a stannic halide complex. The bath is operated at a pH value not in excess of 3. Where desired, the bath also contains a brightener. The electroplating bath is extremely stable and produces high quality electrodeposits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.