Method for coating of polyimide by electrodeposition
US4019877A · kind A · utility
16Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1975 |
| Grant date | Apr 26, 1977 |
| Priority date | — |
| Expiry date | Oct 21, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of coating a copper substrate comprises the steps of: anodically microsmoothing the copper substrate in an acid bath to provide a substantially smooth surface; electrocoating the microsmoothed substrate with a pin hole free nickel film having a thickness of between about 2.5 microns to about 12.5 microns; single step, non-aqueous electrocoating the microsmoothed, nickel coated substrate with a pin hole free polyamic acid polymer, and curing the polyamic acid coating to form a polyimide film free of copper ion contamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.