Vapor bonding method
US4022371A · kind A · utility
12Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1976 |
| Grant date | May 10, 1977 |
| Priority date | — |
| Expiry date | Jun 14, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Components, printed circuit board assemblies and the like to be interconnected by soldering are appropriately fluxed and placed in an atmosphere of a saturated vapor derived from a heat transfer liquid medium having a boiling point above the melting point of the solder. The heat transfer medium is chosen to have a solubility parameter compatible with the solubility parameter of the flux to eliminate the need for subsequent flux cleaning. An alternate embodiment includes a fatty acid in the heat transfer medium, which under some circumstances can eliminate the need to apply flux to the assembly being soldered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.